On the 31st, during the Q3 earnings conference call, Samsung Electronics stated, "Regarding the development status and order outlook of the foundry 2nm (nanometer, one billionth of a meter) process, our 2nm GAA process is being developed as a platform technology optimized for mobile and HPC applications," adding, "We are developing it with the goal of mass-producing products in 2025 by improving process maturity and expanding the IP portfolio."
Samsung Electronics said, "Currently, major customers are evaluating performance, power, and area with our 2nm GAA PDK and design infrastructure in mind for customer productization," and "In the case of certain customers, key IPs and silicon characteristics used in products are being evaluated through MPW (Multi-Project Wafer, a method of testing multiple companies' designs simultaneously on one wafer)."
They also stated, "To secure additional competitiveness of the 2nm GAA, we are developing process and design technologies, and are additionally developing backside PDM automotive technology."
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