Doosan Corporation to Showcase Advanced Copper-Clad Laminate Technology in Taiwan

Participation in the 'Jeonjahoerogipan Expo 2024'

Doosan Corporation announced on the 23rd that it will participate in the "Taiwan Electronic Circuit Board Expo 2024," held from the 23rd to the 25th (local time) at the Nangang Convention Center in Taipei, Taiwan.

Doosan will showcase high-end products such as communication-use copper-clad laminates (CCL), optical module CCL, semiconductor package CCL, as well as the new business of microelectromechanical systems oscillators. Taiwan, with many PCB companies related to high-speed communication, artificial intelligence (AI), and optical modules, is a key market for Doosan Corporation.

Communication-use CCL is a product used in high-speed network substrates and is applied in data centers that need to process large volumes of data. Recently, as AI demand has increased in data centers, faster transmission speeds such as 400GbE (Gigabit Ethernet) and 800GbE are required. Doosan Corporation has developed communication-use CCL that offers fast data processing speeds and minimizes communication latency in response to this market demand. They are also developing CCL tailored to the next-generation network communication standard, 1600GbE.

They will also showcase AI accelerator CCL developed using communication-use CCL. AI accelerators are advanced system semiconductors that can enhance AI performance by accurately and quickly processing core computational functions such as data training and inference required for machine learning and deep learning. The AI accelerator CCL has been recognized for its product competitiveness and is attracting significant market interest.

Optical modules are small devices that connect communication signals transmitted through optical fiber cables between server devices and are essential for fast data transmission within data centers. Doosan Corporation’s optical module CCL features low transmission loss and a low coefficient of thermal expansion. The coefficient of thermal expansion refers to the degree to which an object's volume changes with temperature; the lower the coefficient, the less the volume changes with temperature fluctuations.

According to market research firm Research and Markets, the optical module market is expected to grow annually by about 13.6%, from $23.3 billion (approximately 31.632 trillion KRW) in 2024 to $50.4 billion (approximately 64.4 trillion KRW) by 2030.

Semiconductor package CCL is a material used in PCB substrates that electrically connect semiconductor chips (wafers) and mainboards. It possesses high reliability and high rigidity to withstand high-temperature semiconductor processes and is optimized for the trend of thinning and miniaturization in semiconductors. Microelectromechanical systems oscillators are key components that generate internal signal frequencies in electronic devices and communication systems.

A Doosan Corporation official stated, "The importance of CCL and PCB customers in Taiwan is increasing, and it is necessary to further strengthen marketing and sales capabilities in Taiwan. Through the exhibition, we will widely promote the excellence of Doosan’s products and technologies and do our best to secure new customers."