Rebellion announced on the 16th that it will collaborate with Arm, Samsung Electronics Foundry Division, and AD Technology to develop an artificial intelligence (AI) CPU chiplet platform.
This is to provide AI infrastructure utilizing advanced chiplet technology as demand for AI workloads grows in data center and high-performance computing (HPC) sectors.
In this collaboration, Rebellion will integrate the CPU chiplet designed by AD Technology into its AI semiconductor 'Rebel.' The CPU chiplet is designed based on Arm's 'Neoverse Computing Subsystem V3,' and Samsung Electronics Foundry will manufacture the CPU chiplet using cutting-edge 2-nanometer process technology.
The resulting integrated platform is expected to improve energy efficiency by more than twice in ultra-large language model computations, including LLaMA 3.1 405B (the LLaMA model with 405 billion parameters).
Rebellion plans to accelerate the development of high-efficiency chiplet solutions specialized for AI inference in cooperation with its partners. Rebellion anticipates that combining its chip design expertise with the partners' experience will not only enhance AI computing capabilities but also set new standards for scalability and efficiency in semiconductor solutions.
Jinwook Oh, Chief Technology Officer (CTO) of Rebellion, said, "As a semiconductor startup, Rebellion is adopting chiplet technology at an unprecedented speed to meet the diverse AI workload demands of AI model developers and hyperscalers. We are very honored to lead innovation in the generative AI era by leveraging Rebellion's AI semiconductor technology and experience, and to open a new horizon for the chiplet ecosystem together with our partners."
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