RnT Technology Obtains Ceramic Powder Certification... "Leap into the Global Automotive Market"

RN2 Technology's ceramic powder has obtained the internationally recognized automotive quality management system certification, 'IATF16949.'

According to RN2 Technology on the 10th, IATF16949 is the highest level of quality standard required by major automobile manufacturers worldwide. Companies that acquire this certification qualify to enter the global automotive supply chain. Through this certification, RN2 Technology has proven that it meets the industry's highest standards in quality management, production capacity, and delivery reliability. IATF16949 requires strict compliance with quality management systems, manufacturing sites including production facilities, production performance, and delivery history.

RN2 Technology's ceramic powder is expected to be used as a core material for communication components of global automobile manufacturers. Through this, the company anticipates not only expanding sales in the automotive parts market but also creating additional opportunities in industries with high long-term growth potential.

The company is also in the process of obtaining additional IATF16949 certification for ceramic heat dissipation substrates for power semiconductors. They plan to complete this certification by the end of this year to establish a solid position in the field.

An RN2 Technology representative stated, "Obtaining the IATF16949 certification once again proves that we possess world-class quality and reliability," and emphasized, "We plan to apply our technology not only to the automotive industry but also to various industries with high future growth potential, such as defense, telecommunications, and power semiconductors."

Meanwhile, RN2 Technology is developing a Pin-Fin integrated heat dissipation substrate in addition to the spacer-integrated heat dissipation substrate being developed with global companies. Unlike the conventional method where the Pin-Fin Heat Sink is separated from the ceramic heat dissipation substrate, they plan to integrate it into the ceramic heat dissipation substrate, eliminating the bonding interface. They will implement this as an integrated unit using copper material, which has better thermal conductivity than the aluminum material currently used. This has the advantage of significantly improving the product's heat dissipation effect.