SK Hynix Develops High-Performance SSD for Data Centers with Double the Performance

Power Efficiency Improved by Over 30%
Mass Production to Begin in Q2 Next Year

SK Hynix announced on the 11th that it has developed a high-performance SSD (Solid State Drive) for data centers, the ‘PEB110 E1.S (PEB110)’, which doubles the performance.

SK Hynix Data Center SSD ‘PEB110’. Photo by SK Hynix

An SK Hynix official stated, "As the era of artificial intelligence (AI) is in full swing, customer demand is increasing not only for ultra-high-speed DRAM such as High Bandwidth Memory (HBM) but also for high-performance NAND solution products like data center SSDs. In line with this trend, we have developed a new product applying the ‘PCIe 5th generation (Gen5)’ standard, significantly improving data processing speed and power efficiency, and are introducing it to the market." PCIe (Peripheral Component Interconnect Express) refers to a serial high-speed input/output interface used on the mainboards of digital devices.

The PCIe 5th generation applied to the new product has twice the bandwidth of the previous 4th generation (Gen4). Accordingly, the data transfer speed of the PEB110 reaches 32GTs (giga-transfers per second). Through this, the PEB110’s performance has improved twofold compared to the previous generation, and power efficiency has also improved by more than 30%.

SK Hynix applied the ‘SPDM (Security Protocols and Data Model)’ technology, which greatly enhances information security functions, to this product for the first time in its data center SSD lineup. SPDM is a core security solution specialized in protecting server systems. It supports secure authentication and monitoring of servers. Amid increasing cyberattacks on data centers recently, SK Hynix expects the PEB110 equipped with SPDM to meet customers’ information security requirements.

Through the development of the PEB110, SK Hynix expects to build a more robust SSD portfolio and satisfy the diverse demands of customers. Currently, certification work for the PEB110 is underway with global data center clients. Once certification is completed, mass production is expected to begin in the second quarter of next year, enabling supply to the market.

SK Hynix developed this product in three capacity versions: 2TB (terabytes), 4TB, and 8TB, and supports the ‘OCP 2.5’ version standard to enhance compatibility for application in various global data centers. OCP (Open Compute Project) is an international consortium where major global data center companies participate to discuss standards for hardware, software, and eSSD to build ultra-efficient data centers.

Hyun Ahn, Vice President of SK Hynix (in charge of N-S Committee), said, "This product was developed based on the proven highest-performance 238-layer 4D NAND, securing industry-leading competitiveness in terms of cost, performance, and quality. We will also solidify our position as the world’s number one AI memory supplier in the data center SSD market."