Held from April 4-6 at Incheon Songdo Convensia
Over 240 companies participating... Korea's largest substrate exhibition
LG Innotek unveils innovative semiconductor substrate technology
Samsung Electro-Mechanics introduces next-generation package substrate technology
LG Innotek and Samsung Electro-Mechanics announced on the 4th that they will showcase next-generation semiconductor substrates at the International PCB and Semiconductor Packaging Industry Exhibition (KPCA Show 2024) held from the 4th to the 6th at Songdo Convensia in Incheon.
LG Innotek's exhibition booth participating in the 'KPCA show 2024' held at Songdo Convensia, Incheon from the 4th to the 6th. Photo by LG Innotek
KPCA Show is the largest domestic substrate exhibition featuring domestic and international substrate, material, and equipment companies. This year, about 240 companies from home and abroad are participating. Semiconductor package substrates are products that connect highly integrated semiconductor chips and mainboards to transmit electrical signals and power. With changes in industrial paradigms such as servers, artificial intelligence (AI), cloud, and automotive electronics, semiconductor substrates have become the core of semiconductor performance differentiation. As semiconductor performance advances, semiconductor substrates require sophisticated technologies such as increased internal layers, fine circuit implementation, precise interlayer alignment, and thickness slimming.
LG Innotek will present innovative products and technologies in the fields of high-value semiconductor substrates such as 'Flip-Chip Ball Grid Array (FC-BGA)', 'Package Substrate', and 'Tape Substrate'. A highlight zone will be set up at the front of the exhibition booth to reveal the latest technologies applied to FC-BGA, the company's new growth engine.
LG Innotek's FC-BGA applies proprietary semiconductor substrate implementation technologies such as fine patterning and ultra-small via (circuit connection hole) processing technology, boasting high circuit integration density. Visitors can directly observe the high multilayer and high integration structural features through a 3D enlarged model of the internal structure of the FC-BGA.
In addition, LG Innotek will introduce core technologies necessary for realizing large-area substrates, one of the features of FC-BGA. Multi-Layer Core (MLC) substrate technology is representative. As the substrate area increases, the core layer, which acts as the backbone of the substrate, inevitably becomes thicker to prevent warpage (substrate bending). LG Innotek succeeded in improving signal efficiency with MLC technology that diversifies the material composition of the core layer.
Kang Min-seok, Vice President and Head of the Substrate Materials Business Division, said, "This year's KPCA Show will be an opportunity for LG Innotek's unique substrate technology, accumulated over more than 50 years, to be recognized once again by domestic and international customers." He added, "We will continue to introduce high-value substrate products that provide differentiated customer value and firmly establish our position as an industry-leading company."
Samsung Electro-Mechanics' exhibition booth at the 'KPCA show 2024' held from the 4th to the 6th at Songdo Convensia, Incheon. Photo by Samsung Electro-Mechanics
Samsung Electro-Mechanics organized its exhibition booth into the Advanced Package Substrate Zone and On-Device AI Package Substrate Zone. In the center of the booth, a product breakdown diagram featuring semiconductor substrates was displayed to enhance understanding of the actual application fields of semiconductor package substrates.
In the Advanced Package Substrate Zone, Samsung Electro-Mechanics showcases core technologies of the high-end AI/server FCBGA currently in mass production. The AI/server FCBGA is a highly sophisticated product with a size (area) six times that of a general FCBGA and more than 20 internal layers, twice the number of layers, to process signals at high speed. Samsung Electro-Mechanics is the only domestic company mass-producing server FCBGA and possesses industry-leading technology.
Samsung Electro-Mechanics also introduces next-generation package substrate technologies evolving in line with the trend of semiconductor high performance. These include 2.1D package substrate technology that connects semiconductors without using a silicon interposer between the semiconductor and substrate, and Co-Package substrates that integrate SoC and memory on a single substrate.
In particular, Samsung Electro-Mechanics is unveiling glass substrates for the first time, which apply glass materials to the substrate core to innovatively improve warpage characteristics and signal loss occurring in large-area substrates. By introducing core technologies and key specifications of glass substrates, Samsung Electro-Mechanics emphasized its focus on securing technological competitiveness in the next-generation substrate market.
Kim Eung-soo, Vice President and Head of the Package Solution Business Division at Samsung Electro-Mechanics, said, "Samsung Electro-Mechanics is expanding cooperation with major global customers based on world-class package substrate technology." He added, "We will secure essential technologies required in the next-generation semiconductor substrate market and focus on targeting the high-end substrate markets such as servers, AI, and autonomous driving."
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