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"Let's Boost HBM Competitiveness"... Samsung Electronics Semiconductor Executes Organizational Restructuring

Establishment of HBM Development Team
Reorganization of Advanced Packaging and Equipment Research Divisions

"Let's Boost HBM Competitiveness"... Samsung Electronics Semiconductor Executes Organizational Restructuring

Samsung Electronics is undertaking a major organizational restructuring, including the establishment of a High Bandwidth Memory (HBM) development team. This move is interpreted as an effort to strengthen HBM technology leadership and competitiveness amid the rapid increase in HBM demand driven by the expansion of the artificial intelligence (AI) market.


According to industry sources on the 4th, Samsung Electronics' Device Solutions (DS) division implemented the organizational restructuring on the same day.


Within the Memory Business Division, a new HBM development team responsible for HBM development was established. The new head of the HBM development team is reportedly Vice President Son Young-su, an expert in high-performance DRAM product design.

"Let's Boost HBM Competitiveness"... Samsung Electronics Semiconductor Executes Organizational Restructuring Samsung Electronics Pyeongtaek Campus view.
[Photo by Samsung Electronics]

Since 2015, Samsung Electronics has operated an HBM development organization within the Memory Business Division, and with this restructuring, it plans to further strengthen the dedicated HBM organization to focus on next-generation research and development (R&D).


At the same time, the Advanced Packaging (AVP) development team and the Equipment Technology Research Institute are also being reorganized.


The AVP development team, reorganized from the existing AVP business team, has been placed directly under Young-Hyun Jeon, head of the DS division. This is intended to proactively secure new packaging technologies such as 2.5D and 3D.


Regarding the Equipment Technology Research Institute, the organization has been restructured to enhance semiconductor process and equipment technology support capabilities, focusing on improving the efficiency of semiconductor processes. Technical support for semiconductor mass production equipment will also be strengthened. Through this, Samsung plans to reinforce leadership in HBM and next-generation packaging technologies and secure overall technological competitiveness.


Meanwhile, Samsung Electronics will announce its preliminary second-quarter earnings on the 5th. Although detailed results by business division will not be disclosed, the industry expects Samsung Electronics to have posted operating profits of 4 to 5 trillion won from its semiconductor business alone.


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