Agreement Signed to Foster Talent and Secure Technological Competitiveness in Power Semiconductor Field
Donga University and Dongseo University to Promote R&D Including Glocal Alliance University Field Campus Establishment
Dong-A University (President Lee Haewoo) has signed a business agreement for the "1st Power Semiconductor Industry-Academia K-Forum" and "Industry-Academia-Research Cooperation and Talent Development in the Power Semiconductor Field."
The agreement ceremony, co-hosted by the RIS Dong-A University Clean Energy Convergence Parts and Materials Project Group, the Korea Power Device Industry Association, and Busan Technopark, was held on the 26th at Busan Asti Hotel. The event shared the latest technology trends in the power semiconductor field and discussed future development directions with industry experts.
More than 150 experts from academia, industry, and research institutions attended the event, including Lee Haewoo, President of Dong-A University; Choi Yunhwa, President of the Korea Power Device Industry Association; Jang Jeguk, President of Dongseo University; Kim Hyunggyun, President of Busan Technopark; and Guo Chengkai, Consul General of Taiwan.
On this occasion, Dong-A University signed a business agreement with Dongseo University, the Korea Power Device Industry Association, and Busan Technopark to strengthen industry-academia-research cooperation for the creation of a specialized power semiconductor cluster, with the aim of fostering talent and securing technological competitiveness in related fields.
The main contents of the agreement include sharing technology trends and research results in the power semiconductor field, cooperation for establishing a field campus within the Dong-A University?Dongseo University Glocal Alliance University, promoting joint R&D based on industry-demand projects, and utilizing and exchanging human and material resources.
The forum featured a variety of lectures, including: ▲Power semiconductor technology and market trends for future mobility ▲Junction materials and process technology for SiC power semiconductors ▲Research trends and future prospects of gallium oxide (Ga2O3) power semiconductors ▲Next-generation power semiconductor technology and market trends for future mobility ▲Thermal matching packaging technology for SiC and GaN semiconductors ▲Company introduction and capacity expansion plans of Wolfspeed ▲Introduction of power module package development technology for electric vehicles ▲Double-sided heat dissipation module package technology using pin-fin methods ▲Application of GaN inverters for motor control ▲Reliability evaluation of SiC power semiconductor modules, and more.
In his congratulatory remarks, President Lee stated, "It is meaningful to have a place where experts in the power semiconductor field and industry-academia specialists can gather to share the latest technological information and application cases, starting with the 1st Industry-Academia K-Forum." He added, "I hope that through the synergy of cooperation, Busan will become a domestic hub for power semiconductor production and attract increased investment from domestic and international companies."
Dong-A University is holding a business agreement ceremony to strengthen industry-academia-research cooperation in power semiconductors and the Jisanhak K-Forum, and taking a commemorative photo.
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