Yuanta Securities analyzed on the 14th that Duksan Hi-Metal is in an absolutely undervalued phase.
Researcher Kwon Myung-jun of Yuanta Securities introduced, "Duksan Hi-Metal's main businesses are Solder Ball and Micro Solder Ball (MSB)," and "these products connect chips and substrates during the semiconductor packaging process, transmitting electrical signals."
He continued, "The semiconductor packaging market is expected to grow," and "the fixed transaction price of memory semiconductors has been rebounding since October last year." He added, "Sales related to solder balls are expected to increase," and "domestic and overseas substrate companies anticipate a recovery in FC-BGA demand starting from the second half of this year."
Researcher Kwon analyzed, "Both domestic clients Samsung Electro-Mechanics and LG Innotek expect FC-BGA recovery in the second half of this year," and "Samsung Electro-Mechanics plans to mass-produce FC-BGA, an advanced substrate for AI semiconductors, starting from the second half of this year." He forecasted, "LG Innotek declared its entry into the FC-BGA business in 2022," and "meaningful sales from FC-BGA are expected from the second half of this year."
Researcher Kwon emphasized, "Considering the expectations for growth in the core business and subsidiaries, Duksan Hi-Metal's stock price is undervalued." Duksan Hi-Metal holds shares in Duksan Nepes and Duksan Neolux.
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