[Peace&Chips] Samsung Launches '12-Layer' HBM3E... SK and Micron Also Racing Ahead

Micron Confident in 12-Layer Product at Computex
SK Hynix Introduces 12-Layer HBM3E Sample
Samsung Electronics Faces Urgent Need for NVIDIA Qualification Testing

The semiconductor industry was abuzz all week due to 'Computex 2024,' Asia's largest IT exhibition held recently in Taiwan. Since the event was attended by CEOs of major semiconductor companies such as Jensen Huang of NVIDIA, Intel, AMD, and Qualcomm, every statement made there became a hot topic, significantly influencing the stock prices of related companies.

There were several noteworthy updates regarding High Bandwidth Memory (HBM), a memory used for artificial intelligence (AI). One of these was related to the 5th generation HBM, the 12-stack HBM3E product. HBM is AI memory made by stacking multiple DRAM chips vertically, and the 12-stack HBM3E is a product with 12 layers of DRAM. This belongs to the next-generation products that Samsung Electronics drew attention to when it announced its successful development in February.

At Computex, US-based Micron previewed in a press briefing that its 12-stack HBM3E performance would be the best in the industry. Although Micron entered the HBM market late, it made its mark by being listed as a supplier to NVIDIA with its 8-stack HBM3E in February, showing confidence in its upcoming mass production products. Sampling of the 12-stack HBM3E began in early March, with full-scale mass production expected next year.

Micron is currently focused on expanding its HBM production capacity by building fabs and increasing facilities worldwide, including in the US, Taiwan, and Japan. Since its production capacity is insufficient compared to competitors Samsung Electronics and SK Hynix, it is striving to overcome this. The company has also announced plans to raise its single-digit HBM market share to 30% by next year.

SK Hynix, the leader in the HBM market, is also set to launch its 12-stack HBM3E product soon. The company attracted attention by exhibiting 12-stack HBM3E samples at this Computex following NVIDIA's 'GTC 2024' held in March. As recently as April, SK Hynix announced plans to mass-produce the 12-stack product starting next year, but at a press briefing last month, it advanced the schedule, stating it is preparing for mass production in the third quarter. With NVIDIA shortening its AI semiconductor product release cycle from two years to one year and the HBM generation replacement cycle accelerating, SK Hynix has entered a speed race.

As a result, Samsung Electronics is under increased pressure to pass NVIDIA's quality verification (qualification test) for the 12-stack HBM3E. The company faced a setback recently due to foreign media reports claiming the product failed the test, but the market controversy subsided this week after CEO Jensen Huang denied those reports. Samsung Electronics has announced plans to begin mass production of the 12-stack product within the second quarter, and industry insiders are closely watching whether this can be realized.

Editor's NoteSemiconductors, often called the rice of modern industry. Although we hear the term daily, it’s hard to explain it clearly. Peace & Chips will make the complex concepts and overall industry trends easy to digest. Just place your spoon and enjoy.