Jensen Huang, CEO of NVIDIA, denied rumors of Samsung Electronics' failure in high-bandwidth memory (HBM) certification tests and stated on the 4th (local time) that the certification process is underway.
According to foreign media including Bloomberg, CEO Huang said at a press conference held at a hotel in Taipei, Taiwan, "We are inspecting HBM semiconductors provided by Samsung Electronics and Micron," adding, "Samsung Electronics has not failed any certification tests yet, but Samsung's HBM products require more engineering work."
Earlier, Reuters reported on the 24th of last month that Samsung Electronics failed to pass tests to supply HBM to NVIDIA due to issues such as heat generation and power consumption. Huang's remarks are interpreted as a rebuttal to that report.
At that time, Samsung Electronics issued a statement saying, "We are currently working closely with multiple companies and continuously testing technology and performance," explaining, "We are conducting various tests to thoroughly verify the quality and performance of HBM."
Meanwhile, HBM is a semiconductor that stacks multiple DRAM layers vertically to enhance performance for processing large amounts of data quickly, considered an essential semiconductor in the artificial intelligence (AI) era. Samsung Electronics has developed the world's first 36-gigabyte (GB) capacity HBM3E (5th generation HBM) 12-layer (H) and has sent samples to NVIDIA. It is currently undergoing NVIDIA's own quality verification to supply to NVIDIA.
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