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[Featured Stock] PixelPlus Overcomes Technical Challenges of OnSensor AI Technology... AI Chip Vertical Packaging New Technology Up

PixelPlus is showing strong performance. The news that it has developed ‘Photonic Chiplet’ technology for implementing on-sensor artificial intelligence (AI) appears to be influencing its stock price.


At 9:15 a.m. on the 8th, PixelPlus was trading at 10,950 won, up 23.98% from the previous day.


PixelPlus’s ‘Photonic Chiplet’ is a new technology that vertically stacks and packages an image sensor, an ISP (Image Signal Processor) that processes images, and an AI chip. Compared to conventional multi-chip packaging, this technology has higher manufacturing and design complexity, requiring direct integration of the image sensor and ISP and designs that satisfy environmental factors such as temperature, humidity, and mountability.


PixelPlus developed the ‘Photonic Chiplet’ technology, which had been difficult to commercialize due to technical challenges, improving processing speed and reducing product size compared to existing solutions. It realized ‘on-sensor AI’ by integrating an AI chip into the image sensor. On-sensor AI processes data generated by the image sensor in real time, simultaneously reducing power consumption and execution time, and is expected to be applied to various smart IT convergence platforms such as smart home appliances and smart automobiles.


In the automotive sector, it is expected that between 12 and 20 image sensor-based sensors will be installed per vehicle due to electrification and autonomy. The company anticipates that high-accuracy sensing will be possible through fusion with other types of sensors (Sensor Fusion).


PixelPlus has launched the image sensor ‘PX9210K’ applying Photonic Chiplet technology. The ‘PX9210K’ is an integrated image sensor semiconductor that directly integrates the ISP and the high-performance image sensor ‘PK9210K’ for AI and IoT home appliances, released in January, using Photonic Chiplet technology. It maximizes mountability to be easily installed in small devices requiring image signal processing semiconductors for high-performance video processing such as noise reduction and automatic exposure correction.


Kim Do-hyung, Head of Strategic Planning at PixelPlus, said, “PixelPlus is doing its best in research and development to advance image sensor technology, which is expected to have essential demand in various fields. Going forward, we plan to expand a lineup of on-sensor AI products for automotive and consumer goods by applying the core technology ‘Photonic Chiplet’ for implementing on-sensor AI.”


Unlike general semiconductors, image sensor packages have one side made of glass to allow light to enter, causing spatial constraints when mounting the chip. The ‘Photonic Chiplet’ technology faces many technical challenges, such as applying fast thermal conduction designs to prevent degradation of each sensor pixel caused by heat generated from the ISP. PixelPlus overcame these technical difficulties to develop the ‘Photonic Chiplet’ technology.


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