'Vision and Strategy for the AI Era' Unveiled at Press Briefing
"Securing Top Technology Leadership by Product"
Investment Accelerates in Production Bases in Cheongju, Yongin, and the USA
Kwack No-jeong, CEO of SK Hynix, revealed that the company's high-bandwidth memory (HBM) supply has been completely sold out not only for this year but also for next year. This indicates that supply is unable to keep up with demand, suggesting that memory prices are likely to remain high for the time being.
At a press conference held on the 2nd at the headquarters in Icheon, Gyeonggi Province, under the theme "AI Era, SK Hynix Vision and Strategy," CEO Kwack stated, "We have secured industry-leading technological leadership in products such as HBM, silicon through-via (TSV)-based high-capacity DRAM, and high-performance enterprise solid-state drives (eSSD)."
He also disclosed AI memory technology capabilities, market status, and investment plans for future key production bases in Cheongju, Yongin, and the United States. CEO Kwack explained, "To further solidify market leadership from a technological perspective, we are preparing to provide samples of the world's highest-performance HBM3E 12-stack product in May and to begin mass production in the third quarter." He added, "For sustainable 'qualitative growth,' we plan to strengthen cost competitiveness, increase sales centered on high-profit products to continuously enhance profitability, and improve financial soundness through flexible investment approaches that respond to changing demand environments." CEO Kwack also stated, "We will provide the world's best customized memory solutions through strategic collaboration with global partners."
In addition to CEO Kwack, key executives including President Kim Ju-seon (AI Infrastructure), Vice President Kim Jong-hwan (DRAM Development), Vice President Ahn Hyun (Solution Development), Vice President Kim Young-sik (Manufacturing & Technology), Vice President Choi Woo-jin (P&T), Vice President Ryu Byung-hoon (Future Strategy), and Vice President Kim Woo-hyun (CFO) attended the briefing.
President Kim Ju-seon presented the "AI Memory Vision," Vice President Choi Woo-jin discussed "SK Hynix HBM Core Technology and U.S. Advanced Packaging Initiatives," and Vice President Kim Young-sik spoke on "Cheongju M15X and Yongin Cluster Investments." Vice President Choi said, "Last month, we finalized plans to build an advanced packaging production base for AI memory in West Lafayette, Indiana," adding, "The Indiana plant is scheduled to begin mass production of next-generation HBM and other AI memory products from the second half of 2028." He explained, "Indiana is a key hub in the semiconductor ecosystem known as the Silicon Heartland, centered in the U.S. Midwest."
Vice President Kim Young-sik stated, "To respond to the rapidly increasing AI memory demand, it was necessary to expand production capacity before the first fab in the Yongin semiconductor cluster begins operation in 2027, so we decided to build M15X in Cheongju." He added, "M15X will have an integrated HBM production process including extreme ultraviolet (EUV) lithography and is adjacent to M15, which is expanding TSV production capacity, maximizing HBM production efficiency."
Regarding the Yongin cluster, he said, "The progress rate of the first phase site development for SK Hynix's first fab is 42%, and the schedule is proceeding without any setbacks," noting, "Construction is set to begin in March 2025 and complete in May 2027." He continued, "A mini fab will also be built within the cluster," explaining, "Material, parts, and equipment (SoBuJang) companies will be able to verify prototypes in an environment similar to actual mass production and receive the best solutions to enhance technological maturity."
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