On the 25th, SK Hynix stated in its Q1 earnings conference call that "If construction on M15X starts now, the fab could be opened by the end of 2025."
The company explained, "We have determined that additional cleanroom space is necessary to timely respond to the rapidly increasing demand for artificial intelligence (AI) memory and DRAM," adding, "We decided to invest in M15X to maintain our position in the AI memory market, where we hold a competitive edge, and to proactively address the growing DRAM demand."
They also added, "M15X is adjacent to M15, which is expanding its TSV (Through-Silicon Via) capacity, providing the advantage of optimizing high-bandwidth memory (HBM) production."
They continued, "The Yongin Semiconductor Cluster is currently undergoing site development work," and stated, "It is progressing smoothly with the goal of opening the first fab in 2027."
Furthermore, they said, "The advanced packaging facility in Indiana, USA, was chosen as the mainland U.S. location where major AI customers are concentrated to strengthen leadership in AI semiconductor technology and collaboration with partner organizations, and where active research in advanced back-end process technologies is underway," adding, "It is scheduled to begin operations in the second half of 2028."
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