[Special Stock] TLB Passes Quality Check for AI Server SSD Module PCB... Preparing for Exclusive Supply

TLB is showing strong performance. The news that it has succeeded in passing the PCB quality for AI server SSD modules with higher layer counts than before, based on its technological superiority in SSDs, appears to be influencing its stock price.

As of 10:37 AM on the 18th, TLB is trading at 29,300 KRW, up 7.13% from the previous day.

Yang Seung-su, a researcher at Meritz Securities, stated, "TLB has participated exclusively in the development of SK Hynix's ultra-high-speed MCR DIMM for servers, its main client," adding, "Once full-scale mass production of MCR DIMM begins, we expect an increase in the average selling price (ASP) compared to the past 1-3 layer skip via substrates."

He continued, "TLB maintains the number one market share in SSD substrates among the two domestic memory semiconductor companies," and added, "It is understood that the sales proportion of e-SSD for data centers is high."

Furthermore, he emphasized, "Based on technological superiority in SSDs, TLB has succeeded in passing the PCB quality for AI server SSD modules with higher layer counts than before," and "It is preparing for exclusive supply." He also noted, "Preparation for mass production of CXL-oriented products is progressing smoothly," and judged, "Since all three products have secured a technological gap of about one year compared to competitors, the visibility of mix improvement this year is very high."

Lee Sang-heon, a researcher at Hi Investment & Securities, analyzed, "As AI spreads in the IT industry, global IT companies operating data centers such as Google, MS, Meta, and Amazon have announced plans to expand capacity this year," adding, "Demand for high-performance memory that supports high-capacity and high-efficiency data processing is increasing."

He expected, "Replacement demand for high-performance servers will also recover," emphasizing, "Above all, servers are priced higher compared to consumer products such as PCs or mobiles, placing them in a high value-added area among memory semiconductor applications." He continued, "TLB is developing E1.S, E3, E1.L, which are AI server SSD module PCBs corresponding to ultra-high capacity, high speed, and low power, as a sole vendor," and stressed, "It plans to prepare a mass production system."