Participation in the Largest Printed Circuit Board Exhibition in the US
Doosan Corporation will actively engage in marketing activities centered on high-end copper-clad laminate (CCL) products in the North American market.
Doosan Corporation announced on the 9th (local time) that it will participate in 'IPC APEX Expo 2024,' the largest printed circuit board and semiconductor packaging substrate exhibition in North America, held at the Anaheim Convention Center in California, USA. The IPC APEX Expo features over 430 companies, including global competitors manufacturing CCL such as Resonac, EMC, and TUC, as well as Hanwha Precision Machinery.
Doosan's flagship product, CCL, can be applied to various products such as memory and system semiconductors, 5G communications, and smart devices. It is made of an insulating layer combining copper foil layers, resin, and fillers, with material properties varying according to the mixing ratios of these materials, significantly impacting product performance. Doosan has accumulated about 50 years of experience and know-how to secure the optimal performance ratios required by its customers.
At this exhibition, Doosan will showcase CCLs for memory and system semiconductor packages, communication networks, and flexible copper-clad laminates (FCCL) for smart devices.
CCL for semiconductor packages is a material that electrically connects semiconductor chips and mainboards and protects the semiconductor, divided into memory semiconductor and system semiconductor types. It delivers electrical signals quickly and accurately and has high strength to withstand high-temperature semiconductor processes. It is also optimized for the trend of thinning and miniaturizing semiconductors.
CCL for communication networks is a product applied in data centers, featuring low dielectric constant and low loss characteristics. It can process large volumes of data stably and quickly in high-frequency ranges. Doosan recently developed an AI accelerator CCL based on communication network CCL.
Doosan will also present 800GbE communication network CCL that enhances data processing speed and minimizes communication latency, as well as next-generation 1600GbE communication network CCL currently under development.
FCCL is a core material of flexible printed circuit boards (FPCB) that bend flexibly, mainly used in smart devices such as smartphones and tablet PCs. In particular, Doosan's FCCL boasts durability capable of being folded and unfolded over one million times, with high flexibility and thinness, making it suitable for the latest foldable phones. Additionally, CCLs used in autonomous vehicle communications, next-generation electronic devices, and 5G antennas will also be exhibited.
A Doosan representative stated, "As innovative technologies rapidly advance, the high-end CCL market, which serves as a fundamental material, is expected to grow further. As the world's only supplier with a full lineup of high-end CCLs, we will solidify our position as a top-tier player in the CCL market by supplying products that meet customer demands promptly with differentiated competitiveness."
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