[Special Stock] Hanmi Semiconductor, Continued Demand for HBM-Related Equipment... Target Price Raised to 200,000 Won

Hanmi Semiconductor is showing strong performance.

As of 9:45 AM on the 25th, Hanmi Semiconductor is trading at 99,400 KRW, up 5.97% compared to the previous trading day.

Hyundai Motor Securities stated, “Demand for HBM in the United States is very strong, and the demand for Hanmi Semiconductor’s equipment is expected to increase. The target price has been raised from the previous 130,000 KRW to 200,000 KRW.”

Researcher Kwak Min-jung of Hyundai Motor Securities explained, "As seen at NVIDIA’s GTC 2024, despite performance improvements in the B100, B200, and GB200, and the increase in average selling price (ASP) due to changes in manufacturing methods, supply constraints for these products continue."

She added, "The demand for Hanmi Semiconductor’s HBM-related TSV-TCB equipment and inspection equipment for yield management will increase simultaneously," and "the U.S. Department of Commerce has presented a roadmap for 55-layer HBM by 2035."

She emphasized, "A strategy based on collaboration among TSMC, SK Hynix, and NVIDIA is being devised," and "this will be a significant opportunity factor for Hanmi Semiconductor."

Researcher Kwak predicted, "Since BESI has not yet released memory-oriented hybrid bonding equipment, if Hanmi Semiconductor develops it first, it will solidify its position as a global memory-oriented hybrid bonder." She stressed, "Its status as a global equipment company will be strengthened as a favorable all-rounder player in all positions."