Hanmi Semiconductor announced an order worth 21.5 billion KRW from SK Hynix for its third-generation AI semiconductor high-bandwidth memory (HBM) hyper model equipment, the ‘DUAL TC BONDER GRIFFIN’.
Hanmi Semiconductor received orders for the HBM dual TC bonder from SK Hynix totaling 101.2 billion KRW in the second half of last year, 86 billion KRW in February this year, and now an additional 21.5 billion KRW. This marks the company’s largest cumulative order since its founding, exceeding 200 billion KRW.
Hanmi Semiconductor Vice Chairman Kwak Dong-shin explained, "This year marks the first year in which the dual TC bonder, an essential process equipment for AI HBM, will significantly contribute to sales." He added, "Hanmi Semiconductor has filed 109 patents related to bonding equipment to date and produces dual TC bonders based on its unique technology and expertise."
He further stated, "In the AI semiconductor market, Hanmi Semiconductor’s dual TC bonders, which produce the highest-spec HBM, are sold according to customer needs and specifications with the hyper model Griffin and the premium model Dragon." He also projected, "Hanmi Semiconductor is expected to easily achieve its sales target of 450 billion KRW this year."
According to a KB Securities report, the JEDEC (Joint Electron Device Engineering Council) has decided to relax the stacking height for HBM4 to 775 micrometers (μm), increasing the likelihood that TC bonders will continue to be applied in HBM4 production. The report analyzed that Hanmi Semiconductor’s dominance is expected to continue for more than two years.
KB Securities researcher Park Joo-young explained, "With the height standard relaxed, future technological direction is expected to advance HBM3E production technology into HBM4." He added, "As each HBM generation requires more advanced TC bonders, new equipment orders are expected to continue for HBM4 as well."
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