Securing Market Leadership Through 12-Layer HBM Advancement
Doubling Quantity and Quality of Semiconductor Research Institute
Sales Expected to Recover to 2022 Levels This Year
"We will regain the world's number one position in semiconductors within 2 years, or at the latest within 3 years."
Kyung Kye-hyun, President of Samsung Electronics' DS (Device Solutions) Division, stated at the 55th Annual General Meeting of Shareholders held on the 20th, "We will lead the market by developing a 128GB large-capacity module using 12nm-class 32Gb DDR5 DRAM, and plan to regain leadership in the HBM3 and HBM3E markets through pioneering 12-layer stacked HBM (High Bandwidth Memory)."
President Kyung predicted that the global semiconductor market will grow significantly this year to reach $630 billion (approximately 843 trillion KRW) compared to the previous year. He also forecasted that the DS division's sales will recover to the 2022 level.
Samsung Electronics plans to increase the proportion of advanced processes in DRAM and NAND flash. President Kyung said, "We will develop new processes such as D1c DRAM, 9th generation V-NAND, and HBM4 with the best competitiveness to lead the industry again, and secure cost competitiveness through expanding the share of advanced processes and maximizing manufacturing capacity."
Kyeong Gye-hyun, President of Samsung Electronics DS (Semiconductor) Division. [Photo by Yonhap News]
Regarding the foundry (semiconductor contract manufacturing) business, President Kyung stated, "We have started stable mass production of mobile AP products using the industry's first GAA (Gate-All-Around) 3nm process and plan to prepare for mass production of the advanced GAA 2nm process next year." The 2nm process is an advanced process that Samsung Electronics, TSMC, and Intel have all declared to realize next year. He added, "We will improve the completeness of special processes such as automotive and RF (Radio Frequency), and enhance the maturity of 4, 5, 8, and 14nm processes to expand the customer portfolio."
He also emphasized continuing to strengthen research and development (R&D). Samsung plans to invest 20 trillion KRW in the Giheung R&D complex by 2030. President Kyung said, "We plan to double the semiconductor research institute both quantitatively and qualitatively," and "We will continuously increase research personnel and R&D wafer input to ensure that the results of advanced technology development are quickly applied to mass-produced products."
President Kyung stated, "2024 marks the 50th anniversary of Samsung's semiconductor business, and it will be a year of 'rebound' signaling a full recovery and a year of growth that opens the 'future half-century' of the DS division," adding, "We plan to reclaim the world's number one position in semiconductors within 2 to 3 years."
Han Jong-hee, Head of the DX (Device eXperience) Division and Vice Chairman & CEO, emphasized that this year the DX division will promote 'personalized device intelligence' based on AI. Han said, "Samsung Electronics will fully apply AI to all devices including smartphones, foldables, accessories, and XR to provide customers with new experiences enabled by generative AI and on-device AI."
Han also stated, "Samsung Electronics plans to actively foster new businesses such as next-generation automotive electronics, robotics, and digital health by advancing company-wide AI capabilities."
Additionally, Han said they will realize ▲device control through the Internet of Things (IoT), ▲up to 20% energy savings through AI inside devices, and ▲strong device security through 'Knox Matrix.'
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