Mirae Asset's 'TIGER AI Bandochae Core Process ETF' Surpasses 200 Billion KRW in Net Assets

Mirae Asset Global Investments announced on the 12th that the net assets of the ‘TIGER AI Bandoche Semiconductor Core Process ETF’ have surpassed 200 billion KRW.

According to the Korea Exchange, as of the closing price on the 11th, the net assets of the ‘TIGER AI Bandoche Semiconductor Core Process ETF’ stand at 203.7 billion KRW. This ETF, which invests in key domestic AI semiconductor companies such as Hanmi Semiconductor and Isu Petasys, has exceeded 200 billion KRW in net assets since its listing last November, driven by continued performance improvements of related companies. Notably, among the 15 AI investment ETFs listed domestically (by product name), it is the only one to have increased its net assets by more than 100 billion KRW since the beginning of the year.

The ‘TIGER AI Bandoche Semiconductor Core Process ETF’ focuses on investing in HBM (High Bandwidth Memory), the core of AI semiconductors. HBM is a semiconductor optimized for AI semiconductor demand that significantly increases bandwidth to process large volumes of data at once. Producing HBM semiconductors requires advanced ‘packaging’ core process technology, and currently, South Korea accounts for about 90% of the global HBM market. These companies are expected to benefit greatly alongside the growth of AI semiconductors.

Furthermore, as domestic and international companies expand their investments in AI semiconductors, domestic semiconductor packaging-related companies are expected to benefit. Due to increased AI semiconductor demand, SK Hynix announced plans for large-scale investments exceeding 1 billion USD solely in packaging processes this year. Big tech companies such as NVIDIA, Microsoft, Google, and Meta are actively engaging in technology cooperation discussions, including visits to domestic companies, as they develop their own AI semiconductor chips.

Jeong Eun-bin, ETF Management Team Manager, stated, “AI semiconductor demand continues to grow due to big tech companies developing their own chips,” adding, “With the trend toward diversifying supply chains for stable HBM supply, expectations for related domestic companies are rising, and we anticipate that the ‘TIGER AI Bandoche Semiconductor Core Process ETF’ will benefit from the AI semiconductor era.”