Winpack is showing strong performance. This is interpreted as related to the news that Samsung Electronics is pushing for the introduction of 'Molded Underfill (hereafter MUF)' material in advanced semiconductor packaging, highlighting its track record in applying the related technology.
As of 10:01 AM on the 20th, Winpack is trading at 1,705 KRW, up 8.88% compared to the previous day.
According to industry sources the day before, Samsung Electronics is reportedly considering the introduction of MUF material in the Through-Silicon Via (TSV) process. MUF is a material injected between semiconductors after the TSV process, which drills thousands of tiny holes in the semiconductor to connect vertically.
Until now, Samsung has used a proprietary non-conductive adhesive film (NCF) when vertically connecting semiconductors. NCF has been used as a core material supporting TSV but has also been criticized for being difficult to handle and lowering productivity.
Samsung’s consideration of applying new materials is interpreted as an attempt to improve the process and increase productivity. SK Hynix also used NCF up to the 2nd generation HBM but switched to MUF from the 3rd generation (HBM2E).
Since MUF is cited as a key factor behind SK Hynix’s prominence in the HBM market, it is analyzed that Samsung is also seeking new technology development and adoption. There are opinions that if Samsung introduces MUF following SK Hynix, MUF could become the mainstream technology, significantly changing the materials and components market.
Meanwhile, Winpack is a semiconductor contract manufacturing service and semiconductor production company engaged in semiconductor back-end packaging and testing outsourcing business. It applied the MUF process when developing the F78 DDR4 flip-chip package in 2021. Winpack’s largest shareholder is Above Semiconductor, holding 38.3% of the shares.
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