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[Concall] Samsung Electronics "HBM Sales Volume Sets Record... 4Q Up 3.5x YoY"

On the 31st, Samsung Electronics stated during a conference call following the announcement of its fourth-quarter results that "HBM bit sales volume has been breaking records every quarter, increasing by more than 40% compared to the previous quarter and 3.5 times year-over-year in the fourth quarter." They added, "In particular, HBM3 began mass production in the third quarter, and in the fourth quarter, major GPU companies were added to the customer pool."


They continued, "The proportion of advanced HBM products is increasing, expected to reach half of sales volume in the first half of 2024 and 90% in the second half," and explained, "Commercialization of HBM3E is also progressing as planned, with 8-layer products being sample supplied to customers, and our mass production preparations will be completed in the first half."


[Concall] Samsung Electronics "HBM Sales Volume Sets Record... 4Q Up 3.5x YoY" Samsung Electronics announced that its provisional consolidated operating profit for last year was 6.54 trillion KRW, and sales amounted to 258.16 trillion KRW. Operating profit decreased by 84.92% and sales decreased by 4.91% compared to the same period last year. The photo shows Samsung Electronics Seocho Building in Seocho-gu, Seoul, on the 9th. Photo by Jinhyung Kang aymsdream@

They also said, "HBM products with 12-layer stacking technology are scheduled for sample supply in the first quarter," and "HBM4 is under development with a goal of sampling in 2025 and mass production in 2026."


Regarding custom HBM, they stated, "With the growth of generative AI, demand for customized HBM is increasing," and "We are developing custom HBM by adding logic chips as well as standard products, and are currently discussing detailed specifications with major customers."


They added, "In the future custom HBM market, where collaboration with system semiconductor companies will become important, we will leverage synergies with our foundry, System LSI division, and advanced packaging to competitively respond to the market and lead the industry."


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