RazerCell is showing strength. News that it is about to pass the qualification (quality certification) for Laser Compression Bonding (LCB) equipment seems to be influencing its stock price.
As of 10:48 AM on the 29th, RazerCell is trading at 10,820 KRW, up 12.93% compared to the previous day.
Recently, stocks of companies related to High Bandwidth Memory (HBM) have been rapidly rising in the domestic stock market. As the artificial intelligence (AI) semiconductor market grows, the demand for HBM, an essential component, inevitably increases. Global semiconductor companies are fiercely competing in investments to capture the HBM market.
RazerCell CEO An Geon-jun recently stated in a media interview, "Our goal is to supply LCB equipment to global semiconductor companies within this year."
He added, "We are in the final testing phase of LCB for heterogeneous integration (attaching logic and memory semiconductors flatly) packaging with global semiconductor companies, and LCB equipment to be used for HBM and Graphics Double Data Rate (GDDR) production with global memory manufacturers."
LCB equipment is used in the post-process bonding stage, where semiconductors detached from wafers are bonded onto substrates. HBM requires stacking 8 to 12 DRAM chips and bonding them onto a wafer. The conventional method bonds each individual DRAM chip by thermal compression bonding one by one. RazerCell’s LCB equipment places all 8 DRAM chips on the wafer and bonds them at once by shooting a laser. It reportedly takes only 5 to 9 seconds.
CEO An explained, "Semiconductor production consumes an enormous amount of electricity," and added, "Through LCB, power consumption is reduced to one-tenth compared to the existing method."
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