SK Hynix Components Installed in Huawei's New Smartphone
It has been confirmed that SK Hynix memory semiconductors are installed in the new smartphone of Chinese company Huawei, which is subject to U.S. regulations. SK Hynix stated that it does not have business dealings with Huawei and is investigating the circumstances of the incident.
On the 7th, Bloomberg News reported that, after commissioning semiconductor consulting firm TechInsights to dismantle and analyze Huawei's new 'Mate60 Pro,' it was found to contain SK Hynix mobile DRAM, specifically low-power double data rate (LPDDR) 5, and NAND flash. It also explained that although Huawei sourced most components of the smartphone from Chinese companies, exceptionally, products from the overseas company SK Hynix were included.
Regarding this matter, SK Hynix stated that it has not conducted any transactions with Huawei since the U.S. sanctions were imposed. The company also emphasized that strictly complying with U.S. export regulations is its policy. The company said, "Upon recognizing that our memory chips were used in Huawei's new product, we voluntarily reported this immediately to the U.S. Department of Commerce's Bureau of Industry and Security," and added, "We are investigating the circumstances of the incident."
The problematic smartphone is a new product released by Huawei that applies a processor manufactured using a 7-nanometer (nm; 1 nm is one billionth of a meter) process. Since Huawei released a smartphone including advanced components despite U.S. sanctions, it has attracted attention both inside and outside the industry.
Foreign media explained, "It is unclear how Huawei procured memory semiconductors from SK Hynix," and added, "One possibility is that Huawei utilized component inventory accumulated until 2020, before the full imposition of U.S. trade sanctions."
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