SK Hynix Mass-produces World's Highest Capacity LPDDR5X DRAM...Supplies to Mobile Clients

Package Combining 12 Units of 16Gb LPDDR5X
Equipped in Smartphone Manufacturer Oppo's Latest Product

SK Hynix has developed and delivered to customers the industry's first high-capacity 24-gigabyte (GB) mobile DRAM capable of processing 13 Full HD movies per second.

SK Hynix announced on the 11th that it has been supplying a 24GB package of high-performance DRAM for mobile devices, 'Low Power Double Data Rate 5X (LPDDR5X)', to smartphone manufacturer Oppo since last month. Following the successful mass production of LPDDR5X in November last year, the company developed and began mass production of a package that increased capacity to 24GB for the first time in mobile DRAM.

LPDDR is a DRAM product standard used in mobile products such as smartphones and tablets. It features low voltage characteristics to minimize power consumption. The latest standard is the 7th generation LPDDR (5X), developed in the order of 1-2-3-4-4X-5-5X. SK Hynix is also developing 'LPDDR5T', an enhanced performance version of LPDDR5X, and is conducting customer certification ahead of the launch of the 8th generation (LPDDR6).

The LPDDR5X 24GB package is a product that combines twelve 16-gigabit (Gb) LPDDR5X chips into one. It operates within the voltage range of 1.01 to 1.12 volts (V), which is the minimum voltage standard set by the JEDEC (Joint Electron Device Engineering Council). The data processing speed is 68GB per second, capable of processing 13 Full HD movies in one second.

Oppo incorporated this package into its latest flagship smartphone, the 'OnePlus Ace 2 Pro', which was released on the 10th. Louis Lee, Vice President of Marketing at Oppo, said, "By receiving the 24GB LPDDR5X supply in a timely manner, we have launched the industry's first smartphone equipped with the world's highest capacity DRAM."

SK Hynix introduced the High-K Metal Gate (HKMG) process to the LPDDR5X 24GB package, achieving industry-leading power efficiency and performance simultaneously. HKMG is a next-generation process technology that uses materials with a high dielectric constant (K) in the insulating layer inside DRAM transistors to prevent leakage current and improve capacitance (the amount of charge stored). It is used to increase product speed while reducing power consumption. SK Hynix was the first in the industry to apply the HKMG process to mobile DRAM and succeeded in mass-producing LPDDR5X in November last year.

Park Myung-su, Vice President of SK Hynix (in charge of DRAM marketing), said, "We expect the use of our LPDDR products to expand beyond mobile devices to PCs, servers, high-performance computing (HPC), and automotive sectors," adding, "We will lead the premium memory market by proactively supplying the highest performance products demanded by customers."