[Special Stock] Costexis, the World's Only Vertically Integrated Essential Material and Package for Electric Vehicle Power Semiconductors Upgraded

The stock price of Costexsys, which was listed on the KOSDAQ market through a merger with Kyobo No.10 Special Purpose Acquisition Company, is rebounding.

As of 10:04 AM on the 4th, Costexsys is trading at 3,390 KRW, up 5.94% from the previous day. This appears to be a rebound after a nearly 18% plunge over the past three days.

Costexsys has developed next-generation vehicle SiC power semiconductor high-heat dissipation spacers and is delivering prototypes to domestic and international companies. They have developed high-heat dissipation spacers for next-generation vehicle power semiconductors, SiC (Silicon Carbide) semiconductors and GaN (Gallium Nitride) semiconductors, which can replace existing vehicle power semiconductors made of silicon (Si). Currently, they are continuously supplying prototypes to Hyundai Motor Company and LG Magna.

Silicon semiconductors, which account for the majority of existing power semiconductors, lose their semiconductor functionality when operating temperatures exceed about 150 degrees Celsius. To overcome this drawback, next-generation semiconductors attracting attention are SiC and GaN semiconductors. Due to their superior material properties, SiC and GaN semiconductors can operate at high temperatures above 150 degrees Celsius, unlike silicon semiconductors. Semiconductor chips have low thermal expansion, but typical copper substrates have high thermal expansion, causing the solder where the chip is mounted to crack, which leads to loss of semiconductor functionality and can even result in explosions or fires.

In SiC and GaN semiconductors, thermal matching of the chip mounting substrate is inevitably considered, requiring a heat dissipation material with low thermal expansion and high thermal conductivity. After successfully developing a low thermal expansion, high heat dissipation material optimized for thermal matching with SiC and GaN semiconductors, Costexsys developed an RF (Radio Frequency) package for 5G communication GaN semiconductors and supplies it to many domestic and international companies, including the global semiconductor company NXP.

Recently, with the full-scale order intake of 5G communication GaN semiconductor RF packages from NXP and in preparation for future demand for vehicle high-heat dissipation spacers, Costexsys is investing in mass production facilities related to mass production.

Han Kyu-jin, CEO of Costexsys, said, "Costexsys has succeeded in domestic production of low thermal expansion, high heat dissipation materials, essential materials for SiC and GaN semiconductors that were previously dependent on imports from advanced countries such as Japan, securing global product competitiveness." He added, "We will actively target domestic and international markets in line with the high growth of next-generation power semiconductors to create mid- to long-term growth engines."

He continued, "By successfully vertically integrating from materials to package products, Costexsys is currently the only company in the world producing everything from materials to products."