SK Hynix Rewards Outstanding Performance Teams from Last Year Through Employee Evaluations

'SK Hynix Awards' Held... D-RAM Team and Others Receive Honors

SK Hynix held the ‘SK Hynix Grand Prize’ award ceremony at its Icheon Campus Research & Development (R&D) Center and recognized outstanding performance teams that contributed to the company’s growth last year, the company announced on the 17th. About 200 members, including Park Jung-ho, Vice Chairman and CEO of SK Hynix, and Kwak No-jung, President and CEO of SK Hynix, gathered to encourage the awardees.

The SK Hynix Grand Prize is an annual event that rewards teams that contributed to the previous year’s business goals to motivate employees and promote SK Group’s management philosophy (VWBE: Voluntary and Willful Brain Engagement). It is also the company’s most prestigious internal award ceremony. The award categories are ▲BIC (Best In Class) Tech ▲Future Path Finding ▲Customer First ▲Social Value.

SK Hynix Grand Prize Trophy /
[Photo by SK Hynix]

BIC Tech recognizes teams that have secured technological competitiveness and achieved a super-gap in technology. Future Path Finding is awarded to teams that have established core infrastructure and mid-to-long-term competitiveness. Customer First goes to teams that have maximized customer value and increased market value, while Social Value is given to teams that contributed to tangible and intangible stakeholder value and profit generation. This year, a total of six cases were selected: three in BIC Tech, and one each in Future Path Finding, Customer First, and Social Value.

In the BIC Tech category, the DRAM development, Future Technology Research Institute, and NAND development teams were honored. The DRAM development team was recognized for developing LPDDR5 using the HKMG-applied 1a nanometer process, the Future Technology Research Institute for innovating DRAM cell structures and maximizing net die (chips produced per wafer) competitiveness, and the NAND development team for customer certification of 176-layer NAND and improving cost competitiveness.

In the Future Path Finding category, the external cooperation team that supported the establishment of the M16 and Yongin Semiconductor Clusters received the award. The Customer First award went to the DRAM development team that secured competitiveness by rapidly launching and supplying HBM3 to the market and succeeded in exclusive supply to customers. In the Social Value category, the P&T (Package & Test) and Business Strategy teams were recognized for their achievements in early establishment of overseas P&T sites, responding to changes in the global supply chain, and enhancing cost competitiveness.

Members of the DRAM organization who won an award in the BIC Tech field are delivering their acceptance speeches. From left to right: Choi Jongchan, Product Solution PI TL; Hong Yunseok, Mobile Design PL; Shin Wonho, Mobile AE PL; Jo Seongkwon, Mobile PE1 Team Leader; Son Yoonik, Peri Device Team Leader. / Photo by SK Hynix

Starting this year, SK Hynix adopted a judging method where employees directly select the award-winning cases. This increased employee interest and participation and boosted the pride of awardees recognized by their peers. The teams that won the final awards received significantly increased prize money compared to last year, based on their contributions.

Vice Chairman Park said, "At the core of SK Hynix’s technological innovation are always our employees,” adding, “We can be proud that our technology is making a significant contribution to the advancement of global IT.” He continued, “Let us all prove the value of SK Hynix together through unprecedented challenges and innovations and move forward as a world-class global technology company.”