Samsung Electro-Mechanics Partners with Pohang University of Science and Technology to Foster Talent in Materials and Components through Recruitment Collaboration

Samsung Electro-Mechanics and Pohang University of Science and Technology Sign 'Talent Development Agreement'

President Jang Deok-hyun of Samsung Electro-Mechanics (left) and President Kim Moo-hwan of Pohang University of Science and Technology are taking a commemorative photo after signing a business agreement. / Photo by Samsung Electro-Mechanics

[Asia Economy Reporter Kim Pyeonghwa] Samsung Electro-Mechanics announced on the 20th that it has signed a memorandum of understanding (MOU) to establish a recruitment-linked talent development program with Pohang University of Science and Technology (POSTECH) to secure technological competitiveness in the materials and components sector and to nurture specialized personnel.

Samsung Electro-Mechanics will propose future technology themes related to materials and components to POSTECH, and related departments such as the Department of Materials Science and Engineering at POSTECH will operate project research and customized educational programs. To this end, 14 professors from POSTECH will participate in the training program.

The education targets are selected graduate students in master's and doctoral programs related to materials and components at POSTECH. They will receive scholarships and tuition support during their studies and will join Samsung Electro-Mechanics after graduation.

Jang Deokhyun, President of Samsung Electro-Mechanics, said, “As technological competition in the materials·components industry becomes increasingly fierce, it has become important to nurture and secure specialized talent,” adding, “This agreement is expected to strengthen not only Samsung Electro-Mechanics’ technological competitiveness but also the foundation of Korea’s materials·components industry.”

Meanwhile, Samsung Electro-Mechanics is developing next-generation components for IT and automotive electronics fields with core technologies such as materials, multilayer thin film molding, and fine circuit implementation. Through its central research institute dedicated to research·and development, it is securing future technologies.