Seokyeong AT Challenges Localization of Semiconductor Core Material 'Underfill Fine Silica'

Participation in Government Project Hosted by Evertec Enterprise
Total 4 Years, 6.3 Billion KRW Scale

[Asia Economy Reporter Kwangho Lee] Seokgyeong AT announced on the 10th that it has been selected for a national project to develop "semiconductor underfill materials and packaging technology for fine pitch of 50㎛ or less." The total project cost is approximately 6.3 billion KRW, including 4.9 billion KRW in government funding. The project will be carried out over a total of four years, covering both technology development and demonstration.

This project is led by Evertec Enterprise, which manufactures underfill, thermal interface materials, and semiconductor encapsulants. Seokgyeong AT will participate as a research institution developing and supplying silica microparticles tailored to the characteristics of underfill. The ultimate goal of this project is to secure underfill materials, processes, and packaging technologies that exhibit low coefficient of thermal expansion (CTE), elastic modulus, capillary flow, and high reliability.

With the recent rapid increase in demand for advanced mobile packages, the demand for underfill capable of applying ultra-fine pitch has also grown significantly. In particular, ultra-fine and highly integrated underfill materials of 50㎛ or less are core materials in the system semiconductor field applied to IT, mobile, display, and automotive sectors, and their importance is increasing as essential materials for realizing highly integrated semiconductor packages and modules, the company explained.

A Seokgyeong AT official stated, "By developing high-purity fine silica, a key material that controls the coefficient of thermal expansion, we plan to contribute to reducing import dependence in this field." He added, "After the project ends, we have set a goal to increase the domestic market share of powder materials for underfill to 20% within three years, aiming for an additional sales revenue of about 5 billion KRW."

Im Hyungseop, CEO of Seokgyeong AT, said, "We will actively engage in the high value-added semiconductor core materials business by developing high-purity fine fillers for underfill, which are essential materials in the system semiconductor field and for realizing highly integrated semiconductor packages and modules." He added, "We will strive to support the growth of the domestic ceramic industry through import substitution effects and to create new markets."