iWinPlus Completes National Project on Ultra-Thin Temperature Sensor Package

[Asia Economy Reporter Hyungsoo Park] Image sensor packaging company iWINPLUS announced on the 28th that it has successfully completed a national project under the 2021 Chungbuk Regional Specialized Industry Promotion Support Project, hosted by the Small and Medium Business Technology Information Promotion Agency. The project involved the development of ultra-thin temperature sensor package technology for mobile and wearable devices.

iWINPLUS conducted research in collaboration with domestic temperature sensor design and manufacturing companies. They developed multi-chip package technology by stacking a controller chip (ROIC Sensor chip) and a temperature sensor chip (Thermopile sensor chip) using flip-chip and wire bonding processes. Through this, they succeeded in developing an ultra-thin temperature sensor package measuring 2.0x2.0x1.45mm, the smallest size among domestically developed packages.

By applying Korea's first vacuum hermetic sealing technology, they improved sensitivity performance by 15-20% compared to packages under atmospheric pressure. They secured technological competitiveness through enhanced sensitivity performance relative to sensor size and reduction in sensor chip and package size.

An iWINPLUS official stated, "Through the national project, we overcame the package size limitations occurring in existing temperature sensor package methods such as Transistor Outline Can (TO can) and Surface Mount Device (SMD) types."

He added, "By securing high-performance functionality (JEDEC Level 3) suitable for mobile and wearable devices, convenient body temperature measurement and easy data management will become possible."

The micro infrared sensor specialist company jointly developing ultra-small non-contact infrared temperature sensor technology with iWINPLUS is currently conducting product performance evaluations targeting integration into major Chinese companies' True Wireless Stereo (TWS) earbuds. This technology has established entry barriers by securing two intellectual property rights.