First Official Recognition of Ultra-Thin Foil Applicable to Next-Generation MSAP in Domestic Copper Foil Industry
Copper foil manufactured by CFL, the European subsidiary of Solus Advanced Materials (Photo by Solus Advanced Materials)
[Asia Economy Reporter Lee Hye-young] Solus Advanced Materials announced on the 13th that it has obtained final approval from SK Hynix for ultra-thin materials used in semiconductors.
This is the first time that a material has been officially recognized in the domestic copper foil industry as applicable to MSAP (Modified Semi-Additive Process), a next-generation fine circuit manufacturing method.
The ultra-thin copper foil developed specifically for SK Hynix is a culmination of Solus Advanced Materials' copper foil manufacturing technology. It features an extremely thin thickness of 2μm (1μm is one-millionth of a meter), which is about 1/50 the thickness of a human hair. In particular, it realizes copper foil properties suitable for MSAP, which enables miniaturization, integration, and high performance of semiconductors through finer circuit line widths.
This material approval is an achievement of the independent technology of Circuit Foil Luxembourg (CFL), Solus Advanced Materials' European subsidiary. CFL has world-class copper foil manufacturing technology and customer-tailored material mass production experience through △establishing mass production facilities for ultra-thin copper foil under 2μm △various surface treatments △optimization of plating processes.
Fabienne Bojet, Head of the Copper Foil Business Division at Solus Advanced Materials, said, “We passed the entire material approval process, including the most demanding reliability tests, in one and a half years, shortening the usual period of over two years. We expect this approval to contribute to the localization of SK Hynix's core semiconductor materials and to make Solus Advanced Materials' entry into the global semiconductor value chain visible, resulting in a win-win for both parties.”
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