[Asia Economy Reporter Song Hwajeong] Daeduck Electronics is showing strength amid expectations of increased sales of semiconductor package substrates. It recorded a 52-week high during trading.
As of 9:54 AM on the 24th, Daeduck Electronics was trading at 18,100 KRW, up 900 KRW (5.23%) from the previous day. During the session, it rose to 18,550 KRW, setting a new 52-week high.
The stock price rise is interpreted as being driven by expectations of improved earnings due to increased sales of semiconductor package substrates. Kwon Seongryul, a researcher at DB Financial Investment, said, "With increased sales of semiconductor package substrates and restructuring of module SiP, operating profit in the third quarter is expected to increase by more than 30% compared to the previous quarter," adding, "The improvement in next year's earnings will become clearer as sales of flip chip ball grid array (FC-BGA) increase further." He continued, "Both FC-BGA and flip chip chip scale package (FC-CSP) semiconductor package substrates are in a supply shortage situation, leading to price increases. Companies that maintain stable production capacity enjoy high profitability, making this a hot industry," and added, "Daeduck Electronics is a player recently gaining attention in the package substrate market due to timely investment in FC-BGA, so investor interest is necessary."
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