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"Galaxy Z Fold3 to Feature New Technologies Including UPC, Polys, and S Pen"

"Galaxy Z Fold3 to Feature New Technologies Including UPC, Polys, and S Pen"

[Asia Economy Reporter Eunmo Koo] Market research firm UBI Research forecasted in its ‘2021 Organic Light Emitting Diode (OLED) Components and Materials Report’ published on the 19th that Samsung Electronics is expected to newly apply Under Panel Camera (UPC), pol-less, and Stylus Pen (S Pen) technologies to the ‘Galaxy Z Fold3,’ which is anticipated to be released next month.


First, UPC is a technology that places the front camera under the screen to realize a full-screen smartphone. According to UBI Research, although several technologies such as the use of transparent PI substrates and laser patterning were mentioned for UPC, it appears that the final method involved laser patterning of the cathode electrode and varying the resolution near the camera to secure maximum transmittance. The transparent PI substrate was analyzed to have not been applied in mass production processes due to the high process temperature of the TFT.


Additionally, pol-less technology is also expected to be applied. Pol-less, a technology that replaces the polarizer with a color filter and anti-reflective technology, has been developed by many panel manufacturers but has not been applied because it did not provide as effective external light reflection prevention as polarizers. UBI Research explained that while polarizers are effective in preventing external light reflection, they reduce the amount of light emitted from the OLED emission layer by more than 50%. Removing the polarizer allows more light to be emitted externally at the same power, so if the same brightness is implemented, battery consumption can be reduced. Samsung Display appears to have implemented pol-less technology by applying color filters, anti-reflective films, and a black PDL (pixel define layer).


The S Pen is expected to ultimately apply the Electromagnetic Resonance (EMR) method, and the UTG is also expected to use the 30um thick product used in the previous model. UBI Research mentioned that although the AES method, which does not require a digitizer due to flexibility issues with the metal digitizer, was considered, it is expected that the S Pen will be applied in a way where digitizers are located on both sides of the panel.


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