[Asia Economy Reporter Kim Hyewon] Doosan Solus has succeeded in securing orders for the high-end ultra-thin films for system semiconductors for the first time in Korea.
According to Doosan on the 16th, Doosan Solus's ultra-thin film with a thickness of 2μm (one two-millionth of a meter) is scheduled to be supplied to next-generation wearable devices from a domestic company, which will begin mass production early next year.
Doosan Solus's subsidiary, Circuit Foil Luxembourg (CFL), succeeded last year in achieving ultra-thin film performance comparable to that of a Japanese material company.
High-end ultra-thin films are key materials in the fine circuit manufacturing process (MSAP) and are widely used in printed circuit boards (PCBs) for system semiconductors in mobile and wearable devices.
A Doosan Solus official stated, "This order is the first case of a domestic material company entering the domestic ultra-thin film market, which was monopolized by Japanese companies," adding, "Doosan Solus will continue to secure business achievements and competitiveness in the high-end ultra-thin film market for semiconductors."
Doosan Solus, which holds the world's number one market share for copper foil used in 5G network equipment, is evaluated to have gained recognition for its technological capabilities not only in high-end copper foil manufacturing but also in the semiconductor field through this order.
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