MOU Signed with Wanju-gun, Techno Green, and KEPCO KDN
Supplying Chillers and Liquid Cooling Solutions
On March 1, LG Electronics announced that it is seeking to supply a total cooling solution for data centers to the artificial intelligence (AI) data center that is scheduled to be built in Wanju-gun, North Jeolla Province, based on its heating, ventilation, and air conditioning (HVAC) technology capabilities.
LG Electronics recently signed a memorandum of understanding (MOU) with Wanju-gun, Techno Green Co., Ltd., and Korea Electric Power Data Network Co., Ltd. (KEPCO KDN) to promote the construction of the Wanju Data Center. This project involves building a 20-megawatt (MW) AI data center, with a total investment of KRW 280 billion planned by 2029. The project recently passed the final power system impact assessment review by the Ministry of Climate, Energy and Environment.
LG Electronics plans to supply a wide range of industrial HVAC solutions for the AI data center, including ultra-large chillers-which are core equipment for efficiently cooling and controlling the massive heat generated in the center-as well as computer room air handlers (CRAH) that regulate temperature and humidity inside the data center, and liquid cooling solutions such as coolant distribution units (CDU). Techno Green will be responsible for the construction and operation of the data center, while Wanju-gun will handle permits and administrative support for the project. KEPCO KDN will oversee stable power supply and the establishment of the operational system.
In particular, LG Electronics' strategy is to actively participate in a variety of business opportunities beyond its existing production, development, and supply of HVAC products optimized for AI data centers. This includes involvement in the design phase, where the selection and placement of cooling solutions for the AI data center are determined, as well as in the maintenance, repair, and operations (MRO) domain through the establishment and management of building management systems (BMS).
LG Electronics emphasized that the competitiveness of its HVAC solutions comes from the company's proprietary "Core-Tech" component technology. The company develops and manufactures high-performance, high-efficiency core HVAC components such as compressors, motors, fan motors, and drives in-house, and continues to invest actively in research and development (R&D) to advance key HVAC technologies such as heat exchangers, inverters, and heat pumps.
Recently, orders related to AI data centers have also increased in major global markets, including the United States, and last year, orders for data center chillers grew to three times the previous year's level.
Jaesung Lee, President and Head of the Eco Solution (ES) Business Division at LG Electronics, stated, "We will continue to expand business opportunities related to AI data centers based on the technological strength and competitiveness of LG Electronics' HVAC solutions, which are recognized for their stability and efficiency."
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