ASML's Next-Generation EUV Tool Ready for Mass Production

ASML's cutting-edge system, the "HIGH-NA EUV (next-generation extreme ultraviolet lithography tool)," is reported to be ready for introduction into mass-production lines at semiconductor manufacturers. As competition in AI semiconductors intensifies, industry observers say this could mark a major turning point.

Reuters Yonhap News Agency

Reuters reported on February 26 (local time), citing a senior ASML executive, that the next-generation EUV tool is ready to be deployed in mass-production processes at chipmakers. The executive described it as "a major step forward for the chip industry."

ASML primarily manufactures extreme ultraviolet (EUV) lithography systems. These tools are essential for advanced chip production at major semiconductor manufacturers such as Taiwan's TSMC and Intel.

The next-generation EUV tool can produce high-performance, high-efficiency semiconductors by enabling finer circuit patterns than existing systems and by simplifying process steps. Marco Peters, ASML's Chief Technology Officer (CTO), explained that downtime for the next-generation tool is limited. He added that it has processed 500,000 silicon wafers and can draw the patterns that form chip circuits with sufficient precision. Taken together, these three indicators show that the tool is ready to be put into mass production.

This system is expected to become core infrastructure for the AI industry, where demand is surging. Given that the current generation of EUV tools is approaching its technical limits in manufacturing complex AI chips, the next-generation system is projected to act as a catalyst for improving the performance of chatbots such as OpenAI's ChatGPT. It is also expected to help chipmakers execute their AI chip roadmaps on schedule in line with rapidly growing demand.

In particular, the tool appears capable of replacing multiple steps in the semiconductor manufacturing process. The executive said the performance is sufficient to persuade customers to replace processes that had been carried out over several steps with a single step.

However, it is expected to take about two to three years for chip manufacturers to complete sufficient testing and development before applying it to actual production lines. The next-generation system is priced at about 400 million dollars (approximately 573 billion won), which is known to be roughly double the price of existing tools.

This content was produced with the assistance of AI translation services.