"Ultra-High-Speed Wireless Communication Semiconductor" Unicon Attracts 18.5 Billion Won in Series B Funding

Cumulative funding reaches 33.6 billion won
Full-scale global push for next-generation wireless communication semiconductors

Unicon, a next-generation ultra-high-speed wireless communication semiconductor developer and supplier, announced on the 27th that it has raised 18.5 billion won in Series B funding.

Major domestic investors participated in this funding round, including BonAngels Venture Partners, Korea Development Bank, Doosan Investment, K& Investment Partners, Reinvestment, and L&S Venture Capital. The company’s cumulative funding has reached a total of 33.6 billion won.

Unicon is developing “UC60,” a 60-gigahertz (GHz) band full-duplex wireless communication semiconductor chip connector. It is evaluated as a wireless solution that can practically replace or supplement existing wired connections in environments where ultra-high speed and low latency are essential.

“UC60” has already completed proof-of-concept not only in smartphones and laptops but also in robotic arm joint sections, and is about to enter mass production and supply. The company has also recently begun related proof-of-concept in the physical AI communication domain, including humanoids, autonomous vehicles, and docking units for space data centers, where its potential applications are considered high.

Based on this investment, Unicon plans to accelerate mass production of its products and expansion into global markets, while also focusing on strengthening its research and development (R&D) capabilities.

Unicon CEO Kim Youngdong said, “Through this funding, we were able to confirm the confidence in the technological capabilities Unicon has accumulated and in our business direction,” adding, “We will focus on further improving our technology completeness while creating tangible value that the market and customers demand.”

This content was produced with the assistance of AI translation services.