Hanmi Semiconductor Launches World's First "BOC COB Bonder" High-Performance Memory Equipment

GDDR and eSSD Processes in One System
Expanding into High-Performance Memory for AI Semiconductors
Process Optimization and Reduced Capital Expenditure

Hanmi Semiconductor has launched the world's first "BOC COB Bonder" and will supply it to the Gujarat plant in India operated by a global memory customer.

According to Hanmi Semiconductor on the 27th, the BOC COB Bonder is the world's first "Two-in-One" bonding system capable of handling both the BOC (Board On Chip) process and the COB (Chip On Board) process with a single piece of equipment. Through the BOC COB Bonder, Hanmi Semiconductor plans to extend its leadership into the high-performance memory segment used in artificial intelligence (AI) semiconductors, including stacked GDDR (stacked graphics DRAM) and enterprise eSSD (stacked NAND flash).

BOC is centered on a "flip" technology, in which the chip is flipped and attached, and is mainly applied to DRAM products that require high-speed signal transmission. COB uses the conventional "non-flip" technology and is a process used for high-capacity NAND flash.

Until now, semiconductor companies had to use separate dedicated systems to handle the two processes. However, as Hanmi Semiconductor has developed a Two-in-One bonding system that can handle both processes with a single piece of equipment, it is expected to secure a strong technological edge. As a result, customers can now respond immediately to product design changes without replacing equipment. In addition, since one system can handle two types of processes, customers can utilize space more efficiently in semiconductor production facilities and significantly reduce capital expenditure (CAPEX).

The BOC COB Bonder incorporates the design know-how of the TC Bonder, in which Hanmi Semiconductor holds the global No. 1 position. In particular, to manage heat, which is critical to semiconductor yield, advanced precision systems have been installed on the chuck table and bonding head, enabling stable temperature control under a wide range of process conditions.

The BOC COB Bonder is expected to be used in the production of high-performance stacked GDDR and enterprise eSSD. With soaring demand for high-performance memory driven by the expansion of AI and data centers, market demand for this new equipment is expected to grow rapidly.

According to market research firm TrendForce, the global memory market is projected to reach 551.6 billion dollars (about 799 trillion won) in 2026, up 134% from the previous year on the back of exploding AI server demand, and to reach 842.7 billion dollars (about 1,221 trillion won) in 2027, up 53% from the previous year, marking a new all-time high.

A Hanmi Semiconductor representative said, "The BOC COB Bonder's core strengths are its process flexibility and production efficiency, as it supports both BOC and COB processes," adding, "Starting with supplies to global customers, it is expected to make a significant contribution to this year's performance, and we will continue to maintain a competitive edge in the high-performance memory market."

This content was produced with the assistance of AI translation services.