Hanmi Semiconductor Unveils World’s First BOC COB Bonder

Hanmi Semiconductor announced on the 27th that it has launched the world's first "BOC COB bonder" and will supply it to the Gujarat plant in India of a global memory customer.

BOC COB bonder. Hanmi Semiconductor

The "BOC COB bonder" is the world's first two-in-one bonding system that can perform both the BOC (Board On Chip) process and the COB (Chip On Board) process with a single piece of equipment.

Having led the HBM TC bonder market, Hanmi Semiconductor has further solidified its position as a game changer through the new "BOC COB bonder" by expanding its leadership into the high-performance memory segment for artificial intelligence (AI) semiconductors, including stacked GDDR (Graphics DRAM) and enterprise eSSD (stacked NAND Flash).

For BOC, the core is the "flip" technology, in which the chip is turned upside down and attached, and it is mainly applied to DRAM products where high-speed signal transmission is essential. COB uses the conventional "non-flip" technology and is a process used for high-capacity NAND flash.

Until now, semiconductor companies had to use separate dedicated equipment to handle the two processes. However, Hanmi Semiconductor has secured technological competitiveness by developing a two-in-one bonding system that can handle both processes with a single piece of equipment.

When product designs are changed, customers can respond immediately without replacing equipment. In addition, since one piece of equipment can now handle two processes, customers can utilize space more efficiently in semiconductor production plants and significantly reduce capital expenditure (CAPEX).

The "BOC COB bonder" incorporates the TC bonder design expertise that has enabled Hanmi Semiconductor to achieve the No. 1 global market share. In particular, to manage heat, which is critical to semiconductor yield, advanced precision systems are installed in the chuck table and bonding head, enabling stable temperature control under a wide range of process conditions.

The "BOC COB bonder" is expected to be used for the production of high-performance stacked GDDR and enterprise eSSD. In line with the surge in demand for high-performance memory driven by the spread of AI and data centers, market demand for this new equipment is expected to expand rapidly.

According to market research firm TrendForce, the global memory market is projected to reach 551.6 billion dollars (about 799 trillion won) in 2026, up 134% from the previous year thanks to booming demand for AI servers, and to reach 842.7 billion dollars (about 1,221 trillion won) in 2027, up 53% from the previous year, setting a new all-time high.

A Hanmi Semiconductor representative said, "The core competitiveness of the BOC COB bonder lies in its process flexibility and production efficiency, as it supports both BOC and COB processes," adding, "Starting with supplies to global customers, it is expected to make a major contribution to improving this year's performance, and we will continue to maintain our competitive edge in the high-performance memory market."

Meanwhile, following the launch of the "TC bonder 4" for HBM4 production in 2025, Hanmi Semiconductor plans to release the "Wide TC bonder" for HBM5 and HBM6 production in the second half of this year. In the AI packaging field, the company will continue to expand its lineup starting with the "Big Die FC bonder," followed by the "Big Die TC bonder" and "Die bonder," and will expand supplies to foundry and OSAT (outsourced semiconductor assembly and test) companies.