LaserCell, a company specializing in advanced packaging equipment based on area laser technology, announced on December 16 that it is currently engaged in technical collaboration with a major Taiwanese foundry regarding next-generation packaging processes utilizing glass core substrates.
LaserCell stated that, based on this project, it expects to see significant equipment sales related to this technology beginning this year. The company is accelerating its business expansion with the goal of turning profitable in 2026, aiming to make that year a turning point.
Recently, the semiconductor packaging industry has seen a surge in demand for AI and high-performance computing (HPC), which has increased the importance of high-density and large-area packaging technologies. As a result, glass core-based FOPLP (Fan-Out Panel Level Packaging) processes, which can replace conventional organic substrates, are gaining attention as next-generation core technologies. Taiwanese foundries are expanding their validation of related equipment to improve productivity and ensure process stability through the adoption of glass core substrates. In line with this trend, LaserCell is collaborating with these companies, focusing on large-area laser reflow and bonding technologies.
LaserCell’s LSR_300_FOPLP system implements ultra-precise laser reflow processes on large glass panels measuring 515×510mm, offering higher productivity, uniform thermal distribution, and minimized panel warpage compared to traditional FOWLP. This equipment is currently undergoing process validation with Taiwanese foundry customers, and phased equipment supply and sales are expected to begin next year.
In addition, LaserCell is in discussions to supply laser equipment for glass core and large-area packaging processes to major global PCB companies in Japan and Korea. Given the high compatibility of glass core substrates with existing PCB manufacturing processes, LaserCell believes its laser reflow and bonding technology will play a key role in the next-generation packaging strategies of PCB companies. The company anticipates that such collaborations have a high potential to lead to large-scale orders in the medium to long term.
Beyond the glass core business, LaserCell also reported that global customer testing and orders are expanding for its existing equipment lineup, including eLMB, LPB, and rLSR, resulting in rapid diversification of its business portfolio. In particular, the company is gradually expanding its sales base in the probe card testing market, micro solder ball processes, and rework processes, raising expectations for improved performance.
A LaserCell representative stated, "Glass core-based packaging represents a significant trend that signals a structural shift across the semiconductor and PCB industries," adding, "Our clear goal is to expand sales in 2025 and achieve profitability in 2026 through collaboration with Taiwanese foundries and supply discussions with major global PCB companies in Japan and Korea."
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