Mass Production and Development of TC Bonder for HBM Since 2022
Supplying Competitive Equipment for the TC-NCF Process
Accelerating Mass Production and Development of Next-Generation Hybrid Bonders
Semes, a semiconductor equipment manufacturer, announced on August 21 that its TC Bonder will receive the IR52 Jang Young Sil Award, the most prestigious industrial technology award in Korea.
The IR52 Jang Young Sil Award has been presented since 1991 to outstanding new technology products and research organizations to foster a culture of industrial technology innovation. The award ceremony is hosted by the Ministry of Science and ICT and organized by the Korea Industrial Technology Association.
The TC Bonder is considered a core piece of equipment in the production of high-bandwidth memory (HBM). Since Semes first developed and mass-produced the highly integrated TC Bonder for HBM in 2022, the company has recorded sales of over 500 billion KRW to date.
Semes' HBM TC Bonder, which is currently in mass production, vertically stacks semiconductor chips manufactured using advanced through-silicon via (TSV) technology onto wafers. It is recognized for its optimal functionality and performance in responding to the increasing number of micro-bumps resulting from the trend toward finer in-out pitch in HBM. In particular, Semes has continuously supplied competitive equipment over several generations for the TC-NCF process, which is known to be advantageous for high-layer stacking. Through precise alignment, as well as heat and pressure control, the company has achieved a stacking precision of less than 1 micron, which is the highest level in the industry even under high loads.
Semes is also accelerating the mass development of next-generation hybrid bonders that can connect chips in high-precision, high-layer stacks without separate connection terminals, in preparation for ultra-fine processes beyond HBM4. By developing world-class multi-layer bonding and wafer-level bonding technologies, the company aims to proactively secure the core foundation for next-generation ultra-high-speed and low-power packaging technologies required in the global artificial intelligence (AI) and high-performance computing (HPC) markets.
Choi Byunggab, head of Semes’ TP team, said, "We are currently conducting demo evaluations of the HBM hybrid bonder, which enables high-precision position control below 500 nanometers and high productivity simultaneously, and we are working to ensure equipment quality and reliability."
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