Equipped in the 'Galaxy Z Flip 7'
Enhanced CPU Performance Compared to Previous Model
Samsung Electronics has unveiled its mobile application processor (AP) 'Exynos 2500', which will be installed in the foldable smartphone 'Galaxy Z Flip 7' set to launch next month.
According to industry sources on the 25th, Samsung Electronics introduced the detailed specifications of the Exynos 2500 on its official website the previous day.
The Exynos 2500 is a chip designed by the System LSI division of the Device Solutions (DS) business, which is responsible for semiconductors, and manufactured by Samsung Foundry using the advanced 3-nanometer (nm, 1 nm = one billionth of a meter) Gate-All-Around (GAA) process.
An AP is a semiconductor that serves as the brain of a smartphone. The Exynos 2500 is the first smartphone AP from Samsung to be produced using the 3-nanometer process.
Previously, in July last year, the Exynos W1000, a wearable AP manufactured using the 3-nanometer process, was installed in the Galaxy Watch 7.
On its website, Samsung Electronics listed the product status of the Exynos 2500 as 'mass production.' This suggests that the yield rate (the proportion of non-defective finished products) has reached a level sufficient for mass production. The Exynos 2500 is expected to be installed in all units of the Galaxy Z Flip 7.
This is also the first time that an Exynos chip will be used in a Samsung flagship foldable phone. Until now, Samsung Electronics has equipped the Galaxy Flip and Fold series with Qualcomm's Snapdragon chipsets.
Optimized for artificial intelligence (AI) smartphones, the Exynos 2500 is capable of up to 59 trillion operations per second (TOPS), a 39% improvement over its predecessor, the Exynos 2400. It also supports AI-based image processing, ultra-high-resolution cameras up to 320 megapixels (MP), and video recording and playback at 60 frames per second (fps) and 30 fps in 8K resolution, respectively.
In addition, the latest Arm architecture-based deca-core (10-core) central processing unit (CPU) delivers a 15% performance improvement over the previous generation, and fan-out wafer-level packaging (FOWLP) technology has been used to enhance power efficiency.
Samsung Electronics plans to hold its new product launch event, 'Galaxy Unpacked 2025,' on July 9 in Brooklyn, New York, where it will unveil the Galaxy Z Flip 7 and Fold 7.
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