Doosan Corporation is introducing high-end copper clad laminate (CCL) products to the North American market to secure new customers.
Doosan announced that it will participate in the "International Microwave Symposium (IMS 2023)" held at the San Diego Convention Center in the United States from the 13th to the 15th (local time). IMS is the largest North American exhibition related to radio frequency (RF) and microwave, hosted by the Institute of Electrical and Electronics Engineers (IEEE).
Doosan will showcase ▲ CCL for 5G and 6G communications ▲ CCL for RF-SiP (Radio Frequency System-in-Package) systems ▲ CCL for automotive radar, a key component of advanced driver assistance systems.
These materials have low dielectric constant and low loss characteristics, helping to reduce communication signal loss and enabling stable and fast processing of large volumes of data. In particular, Doosan utilizes PTFE resin material developed in-house as the insulating layer material of the CCL, making it applicable to ultra-high frequencies and 6G.
Doosan will also exhibit 5G antenna modules and microelectromechanical system (MEMS) oscillators. The 5G antenna module is a core component of 5G wireless repeaters, integrating functions such as signal transmission and reception and frequency conversion. Doosan is currently mass-producing 5G antenna modules for the 28GHz frequency band used in South Korea, Japan, the United States, and China, as well as the 26GHz frequency band for the Indian and Australian markets.
The MEMS oscillator applies microfabrication technology from semiconductor manufacturing processes and is a key component that generates internal signal frequencies for electronic devices and communication systems. Samples are scheduled for release by the end of this year.
A Doosan representative said, "We will develop new material businesses and expand the proportion of high-end products to proactively respond to market demand."
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