Hanmi Semiconductor Unveils 'TC Bonder 4' for HBM4 at SEDEX

Hanmi Semiconductor announced on October 22 that it will participate in 'Semiconductor Exhibition (SEDEX) 2025,' held at COEX in Samseong-dong from October 22 to 24, where it will showcase next-generation semiconductor equipment and strengthen its network with client companies.

At this exhibition, Hanmi Semiconductor will introduce several products for the first time at a domestic event, including the 'TC Bonder 4,' a new piece of equipment for HBM4 production, as well as the '2.5D Big Die TC Bonder' and the 'Big Die FC Bonder,' both of which are used in AI logic semiconductors.

The 'TC Bonder 4' is a core piece of equipment for mass-producing HBM4, the next-generation high-bandwidth memory, and was launched in May. As major global memory companies are planning to begin HBM4 mass production in early 2026, demand for related equipment is expected to accelerate. Hanmi Semiconductor currently leads the global market for TC bonders used in HBM production, holding the number one position worldwide.

The '2.5D Big Die TC Bonder' and 'Big Die FC Bonder' are new products targeting the 2.5D packaging market for AI semiconductors. The '2.5D Big Die TC Bonder' supports large interposer packaging up to 120mm x 120mm, while the 'Big Die FC Bonder' supports up to 75mm x 75mm. This is significantly larger than the conventional universal semiconductor packaging size of 20mm x 20mm, enabling the integration of ultra-large dies and multi-chip assemblies required for AI semiconductors. The 'Big Die FC Bonder' was launched in September, and the '2.5D Big Die TC Bonder' is scheduled for release next year.

This is Hanmi Semiconductor's first time participating in the SEDEX exhibition. Through this event, the company plans to strengthen its network with domestic integrated device manufacturers (IDMs) and outsourced semiconductor assembly and test (OSAT) clients.

A Hanmi Semiconductor representative stated, "Through this SEDEX exhibition, we will introduce our latest bonder equipment to domestic clients and showcase our enhanced technological competitiveness."

Meanwhile, the Semiconductor Exhibition (SEDEX) is the largest semiconductor exhibition in Korea, organized by the Korea Semiconductor Industry Association, and features companies from all sectors, including memory, system semiconductors, equipment, materials, facilities, and sensors. This year, a total of 280 companies are participating, and approximately 60,000 visitors are expected to attend.

Founded in 1980, Hanmi Semiconductor is a global semiconductor equipment company with about 320 clients worldwide. The company is currently the world leader in TC bonders for HBM production and has focused on strengthening intellectual property since 2002, filing more than 120 patents related to HBM equipment to date.